With the advent of 5G, components are beginning to move toward more ports, more integration, and higher complexity.
From the device point of view, in the 2G/3G era, the mobile phone backplane basically sticks to a single component, including filters, power amplifiers, and duplexers. In the 5G era, devices are required to be smaller and smaller, and integration has become a new trend. For example, RF front-end modules integrate antenna switches, amplifiers, duplexers, filters, and the like.
Continue reading What Challenges Does Multi-Port Device Testing Face in the 5G Era?
On the afternoon of October 24th, Anker Anker Innovation held a 2019 new product launch conference in New York and released a variety of charging peripheral products.
Continue reading Anker Launched a Variety of Charging Peripheral Products
Ceramic capacitors are divided into high-frequency ceramics and low-frequency ceramics. A capacitor with a small positive temperature coefficient of capacitance for use in a highly stable tank circuit as a loop capacitor and a pad capacitor.
Continue reading Types and Use of Ceramic Capacitors
1N 4007 has a place with the arrangement of 1NXXXX gadgets. Its an American standard numbering framework standard utilized for semiconductor gadgets. This standard has been embraced all inclusive at this point. In 1N 4007 the initial segment 1N demonstrates single intersection semiconductor. 1N demonstrates 1 intersection though N shows the semiconductor diode. 4007 is the particular number to demonstrate the specific diode. From the electrical perspective, 1N 4007 is good with other rectifier diodes. The diodes having a place with 1N400X arrangement can be supplanted by this specific diode. They are regularly utilized in Embedded Systems Projects.
Continue reading 1n4007 Rectifier Diode
Yesterday we have learn some knowledge about the circuit of bluetooth which controlled by stm32, and today we will introduce the bluetooth module–hc05.
Continue reading How to Use HC-05 Bluetooth Module
The continuous advancement of wireless technology and price cuts will make true wireless headsets mainstream in the next two to three years.
Continue reading American Consumers’ Love for Wireless Headset Brands
The main structure of the thermal overload relay consists of two parts, which consist of a thermal element and an output auxiliary contact.
Continue reading Thermal Overload Relay Wiring Diagram and Reset Method
Thermal overload relays are widely used for overload protection of electric motors due to their simple structure, ease of installation and use. According to the magnitude and duration of the motor starting current, correctly configuring the connection mode of the thermal relay in the circuit is the key to properly selecting the setting current of the thermal relay.
Continue reading How to adjust the thermal Overload Relay
As a long-established instrument manufacturer in the deep-growing instrument industry, MTS has been relying on its advanced technology and professional knowledge to continuously deliver many high-quality products to the instrument industry. Recently, after continuous research and development by the research team, MTS has once again launched a new masterpiece for the whole society – SANSFLEXTM controller.
Continue reading MTS Launches a New SANSFLEX Controller for More Accurate Data
The Bluetooth module is a PCBA board with integrated Bluetooth function. It is used for short-range wireless communication and is divided into Bluetooth data module and Bluetooth voice module according to functions. The Bluetooth module refers to the basic circuit circuit set of the integrated Bluetooth function, which is used for wireless network communication, and can be roughly divided into three types: a data transmission module remote control module. The general module has semi-finished properties and is processed on a chip basis to make subsequent applications easier.
Continue reading STM32 single chip microcomputer controls the circuit of Bluetooth