Microchip Technology Inc. today announced the next-generation Bluetooth 5.0 high-quality dual-mode audio IC and full-certification module designed to help Bluetooth speaker and headset manufacturers maintain product differentiation in the highly competitive wireless audio market.
Microchip’s latest Bluetooth 5.0 certified dual-mode solution helps simplify the bill of materials (BOM) for wireless audio design.
The audio IC and full authentication module includes integrated features, higher power output and Sony HiFi LDACTM codec support.
The low-power IS2083BM IC measures just 5.5 x 5.5 mm and is ideal for small designs, giving developers more room to use larger batteries in the final product. The IS2083BM IC and BM83 modules enable customers to simplify bill of materials (BOM) with highly integrated features, including:
- Embedded mode: Supports application functions without the need for an external host microcontroller.
- Integrated Power Amplifier: The integrated power amplifier includes up to +9.5 dBm of output power, eliminating the need for an external power amplifier.
- Large-capacity flash: With integrated 2 MB flash, this feature provides the ability to store updated files during wireless (OTA) updates and software setup without the need for external storage.
- Support for Sony LDACTM audio codec technology*: With this technology, high-resolution audio extensions extend to the mass market Bluetooth wireless products, no longer exclusive to enthusiasts.
The IS2083BM IC and BM83 modules also integrate Bluetooth Low Energy (BLE), Data Length Expansion (DLE) and LE Secure Connection (LE SC) to increase data throughput by approximately 2.5 when transmitting data (eg during firmware updates) Double, while also improving security.
The IS2083BM IC and BM83 come with a set of development tools, including Microchip’s mobile applications and sample code for rapid development.