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Amers Semiconductor Introduces New Active Stereo Vision System for Easy 3D Sensing Applications

Amers Semiconductor‘s new active stereo vision system can increase the adoption of 3D sensing in smartphones, smart homes, smart buildings and the Internet of Things.

Amers Semiconductor’s new active stereo vision system can increase the adoption of 3D sensing in smartphones, smart homes, smart buildings and the Internet of Things.

Honglong, October 16, 2019, the world’s leading provider of high-performance sensor solutions, Ams AG (Swiss Stock Exchange: AMS) today announced the launch of a new portfolio of active stereo vision technology for consumption Manufacturers of electronics, notebooks, and industrial products can more easily implement face recognition and other 3D sensing applications at a lower cost. Amers Semiconductor is a leader in three 3D sensing technologies, structured light, time-of-flight and active stereo vision (ASV).

Based on extensive 3D experience, Amers Semiconductor adds active stereo vision technology products to its portfolio to meet the needs of more and different 3D sensing applications while helping to lower the price of products in the mobile handset market. Mainstream smartphone OEMs are expected to launch their first products using Amers Semiconductor’s ASV technology this fall. In addition, the new ASV technology can be applied to different industries such as laptops, smart homes and smart buildings.

Lukas Steinmann, vice president and general manager of the 3D sensing module and solutions business line at Amers Semiconductor, said: “Although smartphone manufacturers are the first to use face recognition in high-end consumer electronics, the depth map on which face recognition relies Not only supports many potential product use cases in the consumer market, but also supports many potential use cases in the industrial and automotive markets. Amers Semiconductor has found a new, simpler and lower cost way to generate depth maps, which are broader The realization of 3D sensing applications in the end products opens up more possibilities.”

3D depth map with ASV technology for smartphone, home and building automation (HABA) and Internet of Things (IoT)

Amers Semiconductor has developed a new hardware and software solution that uses ASV technology to generate accurate 3D depth maps and dual infrared cameras to sense targets (using micro laser transmitters). Systems supplied by Amers Semiconductor include: Amales’ Belago product, a vertical cavity surface-emitting laser (VCSEL) emitter that projects a semi-random high-density lattice model on the target; Ames Semiconductor’s PMSILPlus (VCSEL) illuminator, which uses improved wafer-level light-diffusing components to uniformly illuminate the target plane; dual-infrared camera; software from Amers Semiconductor, through the feature points captured by the camera Generate depth images; Amers Semiconductor System Calibration Software; and Amers Semiconductor Face Recognition Software.

Amers Semiconductor’s new ASV solution generates high-precision and accurate depth maps for specific objects, such as faces. Compared to structured light solutions, it is more cost effective, does not degrade the quality and resolution of depth maps, and is easier to assemble.

The depth map generated by Amers Semiconductor’s ASV technology is very accurate, enabling face recognition to meet the payment-quality standards for the first time. They can also be used in other 3D sensing applications such as AR/VR using Instant Location and Map Construction (SLAM); driver monitoring in automotive systems; 3D scanning in smart factory production systems; and electronic door locks and point of sale Terminal system.

The release version of Amers Semiconductor’s ASV reference design is based on the Qualcomm Snapdragon platform for mobile phone optimization. It also leverages the expertise of Amers Semiconductor to design and manufacture wafer-level optical technology. After the Belago lighting module is improved, it can completely focus on the entire area that the IR camera can reliably capture, generating a random high-contrast dot pattern. By integrating wafer-level optics, Amers Semiconductor minimizes design while maintaining high optical quality: The latest Belago devices are available in a 4.2mm x 3.6mm x 3.3mm package, making them ideal for integration into smartphones and other Space is limited in design.

Both the Belago and PMSILPlus transmitters incorporate an eye-safe interlock that automatically shuts down the device in the event of a lens break or fall.

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